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Explain the various steps required in the fabrication of an integrated circuit.
Lithography: The method for pattern definition by applying thin uniform layer of viscous liquid (photo-resist) on the wafer surface.
Etching: Selectively deleting unwanted material from the surface of the wafer. The pattern of the photo-resist is transferred to the wafer by means of etching agents.
Deposition: Films of the several materials are applied on the wafer.
Chemical Polishing: A planarization method by applying chemical slurry with etchant agents to the wafer surface.
Explain Sommerfeld theory Sommerfeld theory : The theory was originally proposed in 1900 to define and correlate the electrical and thermal properties of metals. Later, quantu
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Diffusion: Molecular diffusion, often known as simply diffusion, is a net transport of molecules from a region of higher concentration to one of lower concentration by chance mole
1. Consider the previous heat exchanger. Tune a proportional controller for a) GM = 2; PM = 45 degrees and c) MPH (maximum peak height) occurs at 2 dB (provides a z of ~ 0.4).
Properties of filament and contact materials. The Filament materials must have low resistance temperature co-efficient, high melting point, high mechanical strength, ductility
PROCESSING OF BILL FOR PAYMENT : Your Counsellor will give you one bill. In that bill, you make relevant entries of the following statement using your imagination.
design of condenser
What are the chief characteristics of ferro-electric materials Ferroelectric materials have following characteristics: a) They have a huge dielectric constant which is non-
structure of EDTA and estimation of hardness of water by Edta method
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