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Explain the various steps required in the fabrication of an integrated circuit.
Lithography: The method for pattern definition by applying thin uniform layer of viscous liquid (photo-resist) on the wafer surface.
Etching: Selectively deleting unwanted material from the surface of the wafer. The pattern of the photo-resist is transferred to the wafer by means of etching agents.
Deposition: Films of the several materials are applied on the wafer.
Chemical Polishing: A planarization method by applying chemical slurry with etchant agents to the wafer surface.
a) The vacuum in the headspace of a can of food is normally formed by "hot fill" exhausting - that is, the cans are closed when the can is filled with product at a temperature o
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Explain the mechanism of ferromagnetism Ferromagnetism is the basic mechanism by which certain materials (like iron) form permanent magnets and/or exhibit tough interactions
Projection Printing Projection printing, keep away from mask damage entirely. An image of the patterns on the mask is projected onto the resist-coated wafer, which are many cen
petrolium
The degree of freedom when ice water and water vapour coexist in equilibrium is zero
What is quantum dots?
Explain Loss Angle Loss Angle can be described as the arc-tangent of the electrical dissipation factor.
Your first assessment will cover the design of a monolith reactor for the VOCs removal. Therefore, you are asked to do the following: 1. Choose a specific VOC; 2. Search for the
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