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Explain the various steps required in the fabrication of an integrated circuit.
Lithography: The method for pattern definition by applying thin uniform layer of viscous liquid (photo-resist) on the wafer surface.
Etching: Selectively deleting unwanted material from the surface of the wafer. The pattern of the photo-resist is transferred to the wafer by means of etching agents.
Deposition: Films of the several materials are applied on the wafer.
Chemical Polishing: A planarization method by applying chemical slurry with etchant agents to the wafer surface.
objective of the nasic test
A sample of water is found to contain , Temporary Mg hardness = 20mg/L,Calcium Sulphate =20 mg/L. Calculate Temporary and Pemanent hardness in water.
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Finish the molecular species balance problem I started in class, i.e. find the composition of the product gas.
prove that work is a path function
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100 mol/hr of methane reacts with steam to produce CO2 in a main reaction of the reformer. The amount of steam used is 12.5% excess based on this main reaction. Some of the methane
What is migration current in polarography?
Define Cohesive energy Cohesive energy can be described as the difference among the average energy of the atoms of a solid (especially a crystal) and that of the free atoms.
In what manner hot worked and cold worked products differ? Hot working of a metal is carried out above its re-crystallization temperature. In this case the metal is not strain
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