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Explain the various steps required in the fabrication of an integrated circuit.
Lithography: The method for pattern definition by applying thin uniform layer of viscous liquid (photo-resist) on the wafer surface.
Etching: Selectively deleting unwanted material from the surface of the wafer. The pattern of the photo-resist is transferred to the wafer by means of etching agents.
Deposition: Films of the several materials are applied on the wafer.
Chemical Polishing: A planarization method by applying chemical slurry with etchant agents to the wafer surface.
construction and working of calomel and Ag-AgCl electodes
Semi-conducting materials 1) Semi-conducting are the materials whose valence electrons are bounded somewhat loosely to their atom. 2) They needs energy less than
A food storage chamber requires a refrigeration system of 15-ton capacity operating at an evaporator temperature of -10° C and a condenser temperature of 30° C. Refrigerant Tetrafl
How to design limpet coil for given pressure?
students project question
explane
prove that work is a path function
Explain the problems of flooding and channeling in packed tower
whycoagulant is not used in hot lime soda proces
A sample of water is found to contain , Temporary Mg hardness = 20mg/L,Calcium Sulphate =20 mg/L. Calculate Temporary and Pemanent hardness in water.
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