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Explain the various steps required in the fabrication of an integrated circuit.
Lithography: The method for pattern definition by applying thin uniform layer of viscous liquid (photo-resist) on the wafer surface.
Etching: Selectively deleting unwanted material from the surface of the wafer. The pattern of the photo-resist is transferred to the wafer by means of etching agents.
Deposition: Films of the several materials are applied on the wafer.
Chemical Polishing: A planarization method by applying chemical slurry with etchant agents to the wafer surface.
Hard magnetic materials Permanent magnets are used as passive generators of magnetic field. To produce and maintain the magnetic field, a material should have both high resid
Location and layout : Note the location of the lab with respect to the rest of the building. Is the location satisfactory for efficient functioning? You can study the layout well
Methane containing 4 mol% N 2 is flowing through a pipleline at 105.1 kpa and 22 °C. To check this flow rate, N 2 at the same temperature and pressure are introduced to the piple
If 2 grammes of zinc granules was reacted with excesss hydrocloric acid to evolued hydrogen gas which came to completion after 5 minutes. Calculate the rate of the chemical in gram
Check in and checkout procedure a. Location of Key: Enquire from the technicians as to who opens the laboratory. Does the lab staff have to take the keys from the office or
A insulated vessel is divided by a partition into two parts. Initially, the left side contains steam at 300C, 20 bar, and the right side is evacuated. Then, the partition is sudden
INTRODUCTION : Here you were introduced to the essential features of a good laboratory. Since no two labs are alike, it is important to know the design and organisation of the lab
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Decarboxylation of cinnamic acid
objective of the nasic test
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