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Draw a graph illustrating how resistivity varies with temperature for an intrinsic semiconductor.
b) Gallium nitride, GaN, has an energy gap of 3.36 eV at 300 K. Calculate the wavelength of the light emitted by a GaN LED at this temperature. c) State the standard SI units for:
(i) mobility
(ii) diffusion coefficient (or diffusivity)
(iii) current density. d) The p-type side of a pn junction diode is at a potential of -0.4 V and the n-type side at a potential of +0.3 V. A hole moves from the n-type side to the p-type side. What is the change in the potential energy of the hole in electron volts?
e) State three advantages of ion implantation over diffusion, as a means of introducing additional dopant into a wafer.
f) Explain why the gate current in an MOS transistor is extremely small and give a typical value for this current. g) The terminal voltages for an n-channel enhancement MOS transistor with VT = 0.5 V are:
VG = 5 V
VS = 3 V
VD = 4 V
Determine whether the channel in the device is pinched off in this situation.
Q. Explain the drain and transfer characteristics of P-channel enhancement MOSFET. In p-channel enhancement MOSFET here is a n-type substrate and p doped regions under drain an
Short-Term Measures for Technical Loss Reduction The short-term measures involve measures needs for immediate improvement and reduction of losses within the system. These are
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Q. A practical voltage source is represented by an ideal voltage source of 30 V along with a series internal source resistance of 1.2 . Compute the smallest load resistance that c
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