Define integrated circuits, Electrical Engineering

Assignment Help:

Q. Define Integrated circuits?

For the fabrication of semiconductor circuits, there are three distinct technologies employed:

1. Discrete-component technology, in which each circuit element is an individual component and circuit construction is completed by interconnecting the various components.

2. Monolithic technology, in which all the parts (such as transistors, resistors, capacitors, and diodes) needed for a complete circuit (such as an amplifler circuit) are constructed at the same time from one silicon wafer (which is typically 5 mils or 0.005 inch in thickness).

3. Hybrid technology, a combination of the preceding two technologies, in which various circuit components constructed on individual chips are connected so that the hybrid IC resembles a discrete circuit packaged into a single, small case.

Integrated circuits (ICs), in which several transistors, resistors, wires, and even other components are all fabricated in a single chip of semiconductor, are ideal building blocks for electronic systems. Space, weight, cost, and reliability considerations gave much impetus for the development of ICs. The ability to place circuit elements closer on an IC chip helps in extending the frequency range of the devices.Whereas the IC technology involves the use of only solid-state devices, resistors, and capacitors, the elimination of inductors is necessitated by the fact that typical semiconductors do not exhibit the magnetic properties needed to realize practical inductance values.

ICs are made by microfabrication technologies. The low cost of IC production is a result of planar processing in which fabrication begins with a very flat disc of silicon wafer, 5 to 10 cm in diameter and only 0.5mmthick. The small electronic structures to be built on it are then produced photographically. The technique is known as photolithography, in which a photosensitive lacquer (known as photoresist), which has the property of hardening when struck by light, is used. The fabrication method requires a series of masks, photoetching, and diffusions.

MOSFET chips generally utilize either a p-channel or an n-channel device; hence, these chips are known as PMOS and NMOS, respectively. Alternatively, both p-channel and n-channel devices are used to form compound devices, in which case they are known as complementary MOS (CMOS).Whereas the CMOS has the advantage of low power consumption, only a smaller number of devices can be placed on the chip. MOS technologies are popularly used in computer circuits due to their higher packing densities. Bipolar technologies, however, are used in high-speed applications because they respond more quickly. The device fabrication methods are too involved to be presented in this introductory text.

Small-scale integration (SSI) is used typically for a 20-component op amp, whereas large- scale integration (LSI) puts an entire microprocessor, typically with 10,000 components, on a single chip. The chief beneflts from integrating many components on an IC are low cost, small size, high reliability, and matched characteristics. Of the many IC packaging technologies, the most popular is the dual-in-line package (DIP), which consists of a rectangular plastic or ceramic case enclosing the IC, with protruding pin terminals. While an op amp is commonly supplied in an 8-pin DIP for insertion into some larger circuit, a microprocessor may have a 40- to 64-pin DIP to accommodate the many external connections needed for an LSI chip.


Related Discussions:- Define integrated circuits

MR, how to design a single phase distribution circuit from a supply point t...

how to design a single phase distribution circuit from a supply point to a load(lights)

Define some applications of digital counters, Define some Applications of D...

Define some Applications of Digital Counters? Digital counters are extremely useful in many applications. They can be effortlessly found in digital clocks and parallel-to-seri

Explain thermoplastic materials, Explain Thermoplastic materials. Ther...

Explain Thermoplastic materials. Thermoplastic materials: The properties of such plastic materials do not change considerably when they are melted and after that cooled and s

Explain idiv instructions in 8086 family, Explain IDIV instructions in 80...

Explain IDIV instructions in 8086 family with example and their effect on flag. IDIV: It used to divide a 16-bit signed number with an 8-bit signed no. or 32 bit signed numb

What is the maximum speedup, Question: (a) Explain the following metric...

Question: (a) Explain the following metrics: (i) Throughput (ii) Latency (iii) IPC (b) Of the three factors in the equation (EXCPU = Number of instructions × CPI × cy

Sim set interrupt mask instruction, SIM Set Interrupt Mask Instruction ...

SIM Set Interrupt Mask Instruction This  instruction is used  to mask unmask 8085 interrupts and send  serial  output  data. The accumulator  is used to load the  require data

Show output characteristic of common emitter configuration, Q. Show output ...

Q. Show output Characteristic Of Common Emitter Configuration? Output characteristics: This family of curves may be divided into three regions just as was done for common base

Mechanism of metal removal in electrochemical machining, What is the proces...

What is the process of metal removal in electrochemical machining? What are the basic functions of electrolyte in ECM? Illustrate the following key terms in electrochemical mach

Explain what happen as the frequency increases, Question: (a) A typica...

Question: (a) A typical RF filter is made up of sections using circuit components. One example of a section is the Inductor-Capacitor (L-C) section. State two other types of

Write Your Message!

Captcha
Free Assignment Quote

Assured A++ Grade

Get guaranteed satisfaction & time on delivery in every assignment order you paid with us! We ensure premium quality solution document along with free turntin report!

All rights reserved! Copyrights ©2019-2020 ExpertsMind IT Educational Pvt Ltd