Cooling air at 25c flows through the fins arrant creating a

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Reference no: EM13638665

A 1cm x 2cm semiconductor dissipates 5W and is mounted on a 2cm square, 2mm thick aluminum plate. An 0.1mm thick diamond wafer acts as a heat spreader. the underside of the plate is fitted with ten 15mm long 0.2mm thick rectangular aluminum fins at a pitch of 2 mm. Cooling air at 25C flows through the fins arrant creating a heat transfer of 28W/m^2 K. using 175W/mk for the thermal conductivity of aluminum, estimate the temperature of the base of the semiconductor.

Reference no: EM13638665

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