Like transistors and other types of solid state components, IC's are mounted in packages, which protect them from moisture, dust and other types of contaminations. Many different types of IC packages are available and each type has its own advantges and disadvantages. The most popular IC package is the "Dual In-Line (DIL) package. The packages also make it easier to install the IC's in various types of equipment, since each package contains leads which can be either plugged into matching sockets or plugged into DIL mounting frames.
The IC package shown in figure 6 contains three monolithic IC's, also a network of conductors have been formed on the same base that supports the chip. Various conductor pads on the chips are connected to these conductors with fine gold wires that have been bonded in place. The conductors in turn are connected to two rows of connecting pins along the edge of the package. A lid or cover (not shown) is placed over the opening in the package and soldered into place to provide an air tight (hermetically sealed) unit.
Integrated circuits may also be mounted in "Metal cans" that are similar to the types used to house transistors. The metal can have 8 or more connecting leads and can used to house either monolithic or hybrid type IC's. The advantage of these packages is that they may be installed in a variety of ways. Metal cans can be used over a wide temperature range (-550 - +1250C) and are therefore suitable for military and space applications. Figure shows the DIL and metal can type of packages.