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Thermal spelling: The breaking or cracking or peeling off the refractory is known as spelling. A good refractory must show a good resistance to thermal spelling. Thermal spelling can be decreased by minimizing the development of internal stress by:
(1) Using refractory with high porosity, good thermal conductivity and low coefficient of expansion.
(2) Avoiding sudden temperature changes.
(3) Proper furnace design
air flows through apipe at arte of 200L/S. The pipe of two sections of diameters 20cm and 10cm with asmoth reducing section the pressure are difference between the two pipe sectio
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Semiconductor device applications All transistor types can be used as the building blocks of logic gates, which are fundamental in the design of digital circuits. In digital c
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