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Proximity Printing
The proximity exposure method is same to contact printing except that a small gap, 10 to 25 microns wide, is maintained among the wafer and the mask during exposure. This gap minimizes (but may not eliminate) mask damage. About 2- to 4-micron resolution is possible with proximity printing.
Brazing and Soldering - Both soldering and brazing processes are useful for combination two dissimilar metals. Both brazing alloy and solder have lower melting points than the met
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