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Proximity Printing
The proximity exposure method is same to contact printing except that a small gap, 10 to 25 microns wide, is maintained among the wafer and the mask during exposure. This gap minimizes (but may not eliminate) mask damage. About 2- to 4-micron resolution is possible with proximity printing.
Planar defects * Grain boundaries occur where the crystallographic direction of the lattice abruptly changes. This usually happens when two crystals start growing separately an
Zinc has hcp structure. In a unit cell of zinc, the zinc atoms occupy 74% of volume of unit cell.
Hard-Baking Hard-baking is the final step in the photolithographic process. This step is essential in order to harden the photoresist and better adhesion of the photoresist to
Asxdxxwrefdrtszsdsdreessek question #Minimum 100 words accepdhgugfhjugydt76uejjerugrgrted#
application of neutral refractory
how to calucuate weight% of hydrogen sulphate when density =20 and temparature =80 are given
For a substance explained by the van der Waals equation of state with a constant heat capacity CV : 1) Find the internal energy U(T, V ), relative to a reference state at some T
What are the different types of point defects (i) Vacancies (ii) Interstitialcies Compositional defect (iii) Substitutional impurity (iv) Electronic defects
PROCESSING OF BILL FOR PAYMENT : Your Counsellor will give you one bill. In that bill, you make relevant entries of the following statement using your imagination.
#explain the process of x-ray production..
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