The heat transfer coefficient for convection between the

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Reference no: EM13640716

For a silicon chip at steady state, determine the rate of entropy production. The chip is 5 mm on a side and 1 mm in thickness and is embedded in a ceramic substrate. The chip has an electrical power input of 0.225 W. The top surface of the chip is exposed to a coolant whose temperature is 20?. The heat transfer coefficient for convection between the chip and the coolant is 150 W/m2K. What is the cause of entropy production in this case?

Reference no: EM13640716

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