Describe the changes in microstructure at the interface

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1. What is hot shortness? How does it affect the temperature at which eutectic alloys can be used?

2. Design a processing method that permits a Pb- 15% Sn alloy solidified under nonequilibrium conditions to be hot worked.

3. Design a eutectic diffusion bonding process to join aluminum to silicon. Describe the changes in microstructure at the interface during the bonding process.

Reference no: EM131274982

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