Cooling air at 25oc flows through the fin array with a heat

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Reference no: EM13637918

A 1 cm-wide, 2 cm-long semiconductor device dissipates 5W and is mounted on a 2 cm-square, 2mm-thick aluminum plate via a 0.1 mm-thick diamond wafer that acts as a heat spreader. The underside of the plate is fitted with ten 15 mm-long, 0.2 mm-thick rectangular aluminum fins at a pitch of 2 mm. Cooling air at 25oC flows through the fin array with a heat transfer coefficient of 28 W/m2K. Calculate the temperature of the base of the semiconductor. Use k = 175 W/m-K for the aluminum.

Reference no: EM13637918

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