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In contact printing, the resist-coated silicon wafer is bring into physical contact with the glass photo mask. The wafer is held on a vacuum chuck, and the entire assembly rises until the wafer and mask contact each other. The photoresist is exposed with UV light while the wafer is in contact position with the mask. Because of the contact among the resist and mask, very high resolution is possible in contact printing (e.g. 1-micron features in 0.5 microns of positive resist). The problem with contact printing is that debris, trapped among the resist and the mask, can damage the mask and cause defects in the pattern.
iwant to check first if you can write a report about project that inovlves dynamic simulation before submitting my assignment.
heat exchanger would be difficult to model
Introduction : You will recall previous study of this course about the various duties and activities of a lab staff that facilitate management of the laboratory in an efficient ma
Explain Loss Angle Loss Angle can be described as the arc-tangent of the electrical dissipation factor.
What is Metallization Metallization is the fabrication step in which proper interconnection of circuit elements is made. Aluminum is a popular metal used to be linked ICs, bo
a. Explain the problems of flooding and channeling in packed tower
Defines the process battery limits for a plant to produce 500,000 tonnes per year of bioethanol. You should produce a process flow diagram of the plant and obtain literature capita
define emf and its application
to determine the emf of cell uaing pottentiometre
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