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A silicon wafer is etched in a Cl2 plasma. A mass flow controller (used to meter the gas flow fed to the reactor) shows a reading of 100 sccm (sccm=standard cm3 per min; standard conditions are 273 K and 1 atm). The etching reactor operates at 100 mTorr pressure, and the reactor gas temperature is 500 K. (note: 1 atm =760 Torr.)
(a) What is the chlorine flow rate at the reactor pressure and temperature?
(b) If the etching rate of silicon is 0.50 ?/min, and the wafer is 300 mm in diameter, how many moles of silicon are etched per hour?
A 500-mL volumetric flask containing 0.434 M KCl is emptied and allowed to drain briefly, leaving 1.14 mL of liquid in the flask. The flask is then rinsed by adding 87.5 mL of distilled water and is then used to prepare a standard solution of KNO3..
With what minimum speed must Fran leave the ground in order to lift her center of mass 1.95 m and cross the bar with a speed of 0.70 m/s?
Calculate the amount of heat liberated (in kJ) from 421 g of mercury when it cools from 91.0°C to 11.0°C.
What type of hybridization is used on the central atom in CHCL3?
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next titrates an unknown sample with this DCP solution and reaches the end point at 40.5 mL. How many mg of ascorbic acid were present in the unknown sample
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The Henry's law constant for helium gas in water at 30°C is 3.7 10-4 M/atm; that for N2 at 30°C is 6.0 10-4 M/atm. If the two gases are each present at 1.2 atm pressure, calculate the solubility of each gas. What is the Molarity of He and N2
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Without a reference sample of a pure compound, can melting point alone be used to unambiguously assignt the correct chemical structure
Assume that the specific heat and density of the resulting solution are equal to those of water [4.18 and 1.00 ] and that no heat is lost to the calorimeter itself, nor to the surroundings.
An expanding gas does 150.0 J of work on its surroundings at a constant pressure of 1.01 atm. If the gas initially occupied 68.0 mL, what is the final volume of the gas.
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