Thin-film ic, Other Engineering

THIN-FILM IC:

Unlike the monolithic IC's, which are formed within a semiconductor material (substrate), the thin-film circuit is formed on the surface of an insulating substrate.  In the thin-film circuit, components such as resistors and capacitors are formed from extremely thin layers of metals and oxides, which are deposited onto a glass or ceramic substrate.  Interconnecting wires are also deposited on the substrate as thin strips of metal.  Components such as diodes and transistors are formed as separate semiconductor devices and then permanently attached to the substrate at the appropriate locations.

750_THIN-FILM IC.png


The substrate on which the thin-film circuit is formed is usually less than 2.5cm2.  Depositing tantalum or nichrome as thin films or strips on the surface of the substrate forms the resistors.  These films are usually less than 0.00254cm thick.  The thickness, length and width of each strip that is formed on the substrate determine the value of each resistor.  The interconnecting conductors are extremely thin metal strips, which have been deposited on the substrate.  Low resistance metals, such as gold. platinum, or aluminium, are generally used as conductors.  The substrate is made from an insulating material that will provide a rigid support for the components.  Glass or ceramic materials are often used as substrates.  Figure shows a portion of a thin-film circuit.

Posted Date: 9/14/2012 5:55:39 AM | Location : United States







Related Discussions:- Thin-film ic, Assignment Help, Ask Question on Thin-film ic, Get Answer, Expert's Help, Thin-film ic Discussions

Write discussion on Thin-film ic
Your posts are moderated
Related Questions
what is lloyd''s length

Noise Suppression in Aircraft Design: It has been seen that the first step towards noise suppression is at the design stage of the rotating and static parts of the engine. The

Centrifugal flow - Compressors in Aircraft: The centrifugal impeller is rotated at high speed by the turbine and centrifugal action causes the air between the impeller vanes to

Process of fire risk assessment: In the UK, the process for  the FRA came out of the process for a general risk assessment. In a general risk assessment hazards are identif

Compute the motor size required to pump 28.3 cms through a 3,050 m long, 3.66 m diameter pipeline to an upper reservoir 610 m above the lower reservoir. Use a friction facter of 0.

how would you judge the potential profits of Bajaj electronics on the first year of sales to booth plastics and give your views to increase the profit?

Define the aircraft axes & degrees of freedom. Analyse the different maneuvers that can be done by an aircraft.


Q. Explain briefly the Friction welding techniques.                                                      OR       Discuss any two solid state welding methods.