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Hybrid IC's are formed by utilizing various combinations of monolithic, thin-film and thick film techniques and may in certain circumstances contain discrete semiconductor components in chip form. Therefore many types of hybrid circuit arrangements can be produced. A typical hybrid circuit might consist of a thin-film circuit on which various monolithic IC's have been attached or it could utilize monolithic IC's thick-film components and discrete diodes and transistors that are all mounted on a single insulating substrate.
A portion of a hybrid IC is shown at figure. An insulated substrate is used to support the circuit components as shown. The monolithic IC is mounted on the substrate along with thich-film resistors and a small discrete capacitor. All the components are interconnected with conductors that are formed on the substrate using film techniques. The monolithic IC is connected to the conductors with fine wires that are bonded in place. Thick-film resistors will usually have notches cut into them to trim their values. The capacitor used in these circuits can be formed either by using film techniques or miniature devices can be installed between conductors as shown.
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