What is the power being dissipated in the device

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Reference no: EM131018963

A power transistor is specified to have a maximum junction temperature of 150C. When the device is operated at this junction temperature with a heat sink, the case temperature is found to be 97°C. The case is attached to the heat sink with a bond having a thermal resistance θCS =0.5°C/W and the thermal resistance of the heat sink θSA =0.1°C/W. If the ambient temperature is 25°C, what is the power being dissipated in the device? What is the thermal resistance of the device, θJC , from junction to case?

Reference no: EM131018963

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