Reference no: EM131041284
Microelectronics Fabrication Homework-
1- What is the difference between wet and dry oxidation? Which one is faster? Which one has a better quality?
2- What is FOX? Why FOX region goes under the wafer's surface?
3- What is channel stop? Please explain why it is used.
4- What is the difference between self-aligned and in self-aligned fabrication techniques?
5- What is LDD? Explain.
6- What is a hot carrier? Explain.
7- Why spacer is formed near the gate?
8- What is CND? What is LP-CVD? Explain.
9- What is the difference between wet and dry etching?
10- What is sputtering? Explain.
11- What is Salicide? Explain.
12- What is sintering? Explain.
13- What is RIE and how does it work?
14- What is the energy in Key that is expressed in ion implantation?
15- What is the typical thickness of gate wide?
16- What is the typical thickness of FOX?
17- Why threshold voltage adjustment is done? How does it work?
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